underfillv2rev 52011-02-15IEC 62258
underfill
0112/2///61360_4#AAD126
details of any requirements or recommendations for underfill between a bumped die or a minimally-packaged device and its mounting surface
- Used by classes
- 3
Also appears in1#
Entities with the same name in other dictionaries:
- Code
AAD126- Data type
- STRING_TYPE
All properties20#
- Version
- 2
- Revision
- 5
- Preferred name
- underfill
- Short name
- underfill
- Definition
- details of any requirements or recommendations for underfill between a bumped die or a minimally-packaged device and its mounting surface
- Definition source
- IEC 62258
- Definition class
- 0112/2///61360_4#AAA302die device
- Drawing reference
- M..70
- Responsible committee
- SC3D
- Publisher
- IEC
- Published in
- IEC 61360-4
- Published in
- NON_DEPENDENT_P_DET
- Status level
- Standard
- Version release date
- 2015-08-17
- Revision release date
- 2011-02-15
- Version initiation date
- 2015-08-17
- Original definition date
- 2003-02-21
- MDC_P001_6
- 0112/2///61360_4#AAD126underfill
- MDC_P022
- STRING_TYPE
- MDC_P040
- A55