T_assyv2rev 52011-02-15IEC 62258
maximum assembly temperature
0112/2///61360_4#AAD149
maximum temperature to which the backside surface of a die device may be raised during assembly
- Used by classes
- 1
Also appears in2#
Entities with the same name in other dictionaries:
- Code
AAD149- Data type
- LEVEL(MAX) OF REAL_MEASURE_TYPE
- Unit
- UAA033 UAA033
All properties23#
- Version
- 2
- Revision
- 5
- Preferred name
- maximum assembly temperature
- Short name
- T_assy
- Definition
- maximum temperature to which the backside surface of a die device may be raised during assembly
- Definition source
- IEC 62258
- Definition class
- 0112/2///61360_4#AAA302die device
- Unit structure
- °C
- Drawing reference
- NR2 S..3.3
- Initial value
- 0112/2///62720#UAA033 UAA033
- Responsible committee
- SC3D
- Publisher
- IEC
- Published in
- IEC 61360-4
- Published in
- NON_DEPENDENT_P_DET
- Status level
- Standard
- Version release date
- 2015-08-17
- Revision release date
- 2011-02-15
- Version initiation date
- 2015-08-17
- Original definition date
- 2003-02-21
- MDC_P022
- LEVEL(MAX) OF REAL_MEASURE_TYPE
- MDC_P025_1
- T_assy}
- MDC_P040
- H02