bump attachmentv2rev 62011-02-15IEC 62258
bump attachment method
0112/2///61360_4#AAD190
description of the processes used in attaching the bumps to a die device
- Used by classes
- 1
Also appears in1#
Entities with the same name in other dictionaries:
- Code
AAD190- Data type
- STRING_TYPE
All properties21#
- Version
- 2
- Revision
- 6
- Preferred name
- bump attachment method
- Short name
- bump attachment
- Definition
- description of the processes used in attaching the bumps to a die device
- Definition source
- IEC 62258
- Definition class
- 0112/2///61360_4#AAA001component
- Drawing reference
- M..255
- Responsible committee
- IEC/TC 47
- Publisher
- IEC
- Published in
- IEC 61360-4
- Published in
- NON_DEPENDENT_P_DET
- Status level
- Standard
- Version release date
- 2024-12-21
- Revision release date
- 2011-02-15
- Version initiation date
- 2024-12-21
- Original definition date
- 2006-11-10
- Change request ID
- C00162
- MDC_P022
- STRING_TYPE
- MDC_P040
- A55