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die codev2rev 52011-02-15IEC 62258

die type code

0112/2///61360_4#AAD004

mnemonic code for the physical form in which the die or wafer is supplied

Used by classes
1
property
Code
AAD004
Data type
ENUM_CODE_TYPE(0112/2///61360_4#ASA000)
Used by classes (1)

Version history4#

  1. Current rev 05
    17 Aug 2015 · 15:40 UTC by BATCH 00000917
    View on cdd.iec.ch ↗
  2. superseded rev 04
    23 Jul 2015 · 11:08 UTC by BATCH 00000907
    ↓ Version JSON
    View on cdd.iec.ch ↗
  3. superseded rev 03
    22 Jul 2015 · 14:21 UTC by BATCH 00000904
    ↓ Version JSON
    View on cdd.iec.ch ↗
  4. superseded rev 02
    27 Apr 2011 · 14:07 UTC by BATCH 00000704
    ↓ Version JSON
    View on cdd.iec.ch ↗

IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.

Metadata#

Remark
If the die or wafer is in its original form, then the code is BARE or DUAL. Die with codes BUMP or LEAD have been post-processed to add the solder bumps or metal lead frame respectively.
Source document
IEC 62258
Version
2
Revision
5
Status
Standard
Publisher
IEC
Published in
IEC 61360-4
Responsible committee
SC3D
Dates
  • Original: 2003-02-21
  • Current version: 2011-02-15
  • Current revision: 2015-08-17