t_wafer(tol)v2rev 62011-02-15IEC 62258
wafer thickness tolerance
0112/2///61360_4#AAD186
nominal tolerance on the thickness of a semiconductor wafer containing die devices
- Used by classes
- 1
Also appears in1#
Entities with the same name in other dictionaries:
- Code
AAD186- Data type
- LEVEL(NOM) OF REAL_MEASURE_TYPE
- Unit
- UAA726 UAA726
All properties24#
- Version
- 2
- Revision
- 6
- Preferred name
- wafer thickness tolerance
- Short name
- t_wafer(tol)
- Definition
- nominal tolerance on the thickness of a semiconductor wafer containing die devices
- Definition source
- IEC 62258
- Definition class
- 0112/2///61360_4#AAA001component
- Unit structure
- m
- Drawing reference
- NR2..3.3
- Initial value
- 0112/2///62720#UAA726 UAA726
- Responsible committee
- IEC/TC 47
- Publisher
- IEC
- Published in
- IEC 61360-4
- Published in
- NON_DEPENDENT_P_DET
- Status level
- Standard
- Version release date
- 2024-12-21
- Revision release date
- 2011-02-15
- Version initiation date
- 2024-12-21
- Original definition date
- 2007-02-14
- Change request ID
- C00162
- MDC_P022
- LEVEL(NOM) OF REAL_MEASURE_TYPE
- MDC_P025_1
- t_wafer(tol)}
- MDC_P040
- T03