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t_wafer(tol)v2rev 62011-02-15IEC 62258

wafer thickness tolerance

0112/2///61360_4#AAD186

nominal tolerance on the thickness of a semiconductor wafer containing die devices

Used by classes
1
property
Code
AAD186
Data type
LEVEL(NOM) OF REAL_MEASURE_TYPE
Unit
UAA726 UAA726
Used by classes (1)

Version history5#

  1. Current rev 06
    21 Dec 2024 · 18:46 UTC by BATCH 00001336
    View on cdd.iec.ch ↗
  2. superseded rev 05
    17 Aug 2015 · 15:40 UTC by BATCH 00000917
    ↓ Version JSON
    View on cdd.iec.ch ↗
  3. superseded rev 04
    23 Jul 2015 · 11:08 UTC by BATCH 00000907
    ↓ Version JSON
    View on cdd.iec.ch ↗
  4. superseded rev 03
    22 Jul 2015 · 14:21 UTC by BATCH 00000904
    ↓ Version JSON
    View on cdd.iec.ch ↗
  5. superseded rev 02
    27 Apr 2011 · 14:07 UTC by BATCH 00000704
    ↓ Version JSON
    View on cdd.iec.ch ↗

IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.

Metadata#

Source document
IEC 62258
Version
2
Revision
6
Status
Standard
Publisher
IEC
Published in
IEC 61360-4
Responsible committee
IEC/TC 47
Change request
C00162
Dates
  • Original: 2007-02-14
  • Current version: 2011-02-15
  • Current revision: 2024-12-21