non-bumped package
quad non-bumped chip-carrier package outline style with standard J-bend leads
- Inherited
- 17
Hierarchy#
Ancestors (top) → AAA445 (highlighted) → subclasses and powertype instances. Capped at 12 each; see the full lists in the sections below.
Higher level classes7#
Declared properties17#
distance as specified by level (miNomax) of the furthest part of the component above the seating plane, measured in a direction perpendicular to the plane
perpendicular distance as specified by level (miNomax) between the seating plane and the base plane
distance as specified by level (miNomax) of the furthest part of the component above the base plane, measured in a direction perpendicular to the plane
major dimension as specified by level (miNomax) of the package, excluding terminals presented for mounting in the length direction, measured in a plane parallel to the seating plane
minor dimension as specified by level (miNomax) of the package, excluding terminals, measured in a plane parallel to the seating plane
linear spacing as specified by level (miNomax) between the true positions of terminal centres
largest overall dimension as specified by level (miNomax) in the direction of the package length which includes the package length and any terminals which are presented for mounting in the length direction
largest overall dimension as specified by level (miNomax) in the direction of the package width which includes the package width and any terminals which are presented for mounting in the width direction
length as specified by level (miNomax) of an index feature
distance as specified by level (miNomax) between lines parallel to the package length and passing through the true centres of terminal positions, measured in a direction parallel to the package width
width as specified by level (miNomax) of the metallized area of the terminal pad on a surface-mount package
length as specified by level (miNomax) of the metallized area of the terminal pad on a surface-mount package
length as specified by level (miNomax) of a second index feature
distance as specified by level (miNomax) between lines parallel to the package width and passing through the true centres of terminal positions, measured in a direction parallel to the package length
quantity of terminal positions in a row in a direction parallel to the length
quantity of terminal positions in a row in a direction parallel to the width
angle as specified by level (miNomax) of a chamfer used as an index feature
Inherited properties (17) — click to expand
code of the name which identifies a particular variant of the shape of the body on a package
code of the name which identifies a particular variant of the shape of the terminals on a package
suffix to the IEC 60191-4 code which identifies the form or shape of the terminals
prefix to the IEC 60191-4 code which identifies the position of the terminals on the package body
total quantity of potential terminal positions in accordance with the specified terminal designation system
maximum quantity of potential terminal positions which can be unoccupied
IEC 60191-4 code which identifies the general physical form of the package
actual quantity of potential terminal positions which are occupied
reference to the identity of the drawing on which the dimension set is based
reference to the identifier for the document from which a dimension set was taken
number of the page in the source document on which the dimension set is given
code by which the manufacturer identifies the package style or a specific dimension set
code of a standard dimension set taken from a standards document
identity of a standards document that contains lists of dimension sets for electric or electronic components
direction of the sequence of numbering of the terminals of a component when viewed from the top
flag to indicate whether the package is intended for surface-mount applications
code of the type of geometry possessed by an electric-electronic component
Subclasses#
No subclasses
This class is a leaf — no other classes inherit from it.
Metadata#
- Version
- 1
- Revision
- 5
- Status
- Standard
- Publisher
- IEC
- Published in
- IEC 61360-4
- Responsible committee
- IEC/SC 3D
- Change request
C00115- Dates
- Original: 2010-11-11
- Current version: 2010-11-11
- Current revision: 2023-04-17
Full source data#
Every key from the original .xls export, including multilingual variants, status, publisher, committee, and workbook-specific codes.
Raw properties (19 keys from source .xls) — click to expand
- C002
- C00115
- C011
- IEC
- C012
- IEC 61360-4
- C016
- Standard
- MDC_P001_5
- 0112/2///61360_4#AAA445
- MDC_P002_1
- 1
- MDC_P002_2
- 5
- MDC_P003_0
- 2023-04-17
- MDC_P003_1
- 2010-11-11
- MDC_P003_2
- 2010-11-11
- MDC_P003_3
- 2023-04-17
- MDC_P004.en
- non-bumped package
- MDC_P005.en
- B002
- MDC_P006.en
- quad non-bumped chip-carrier package outline style with standard J-bend leads
- MDC_P008_1
- DAA040
- MDC_P010
- 0112/2///61360_4#AAA394
- MDC_P011
- ITEM_CLASS
- MDC_P012
- IEC/SC 3D
- MDC_P014
- {0112/2///61360_4#AAG001,0112/2///61360_4#AAG002,0112/2///61360_4#AAG003,0112/2///61360_4#AAG013,0112/2///61360_4#AAG016,0112/2///61360_4#AAG017,0112/2///61360_4#AAG023,0112/2///61360_4#AAG024,0112/2///61360_4#AAG028,0112/2///61360_4#AAG053,0112/2///61360_4#AAG076,0112/2///61360_4#AAG077,0112/2///61360_4#AAG079,0112/2///61360_4#AAG080,0112/2///61360_4#AAG109,0112/2///61360_4#AAG110,0112/2///61360_4#AAG130}
Version history6#
IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.