T_assyv2rev 52011-02-15IEC 62258

maximum assembly temperature

0112/2///61360_4#AAD149

maximum temperature to which the backside surface of a die device may be raised during assembly

Used by classes: 1

property

Also appears in2#

Entities with the same name in other dictionaries:

Code: AAD149
Data type: LEVEL(MAX) OF REAL_MEASURE_TYPE
Unit: UAA033 UAA033

Used by classes (1)

AAA295bare die

Version history4#

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All properties23#

Version: 2
Revision: 5
Preferred name: maximum assembly temperature
Short name: T_assy
Definition: maximum temperature to which the backside surface of a die device may be raised during assembly
Definition source: IEC 62258
Definition class: 0112/2///61360_4#AAA302die device
Unit structure: °C
Drawing reference: NR2 S..3.3
Initial value: 0112/2///62720#UAA033 UAA033
Responsible committee: SC3D
Publisher: IEC
Published in: IEC 61360-4
Published in: NON_DEPENDENT_P_DET
Status level: Standard
Version release date: 2015-08-17
Revision release date: 2011-02-15
Version initiation date: 2015-08-17
Original definition date: 2003-02-21
MDC_P001_6: 0112/2///61360_4#AAD149maximum assembly temperature
MDC_P022: LEVEL(MAX) OF REAL_MEASURE_TYPE
MDC_P025_1: T_assy}
MDC_P040: H02