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wafer mapv2rev 72011-02-15IEC 62258

wafer map

0112/2///61360_4#AAD187

reference to a document or file that contains either a map of a wafer containing die devices, indicating the quality or performance levels of each, or a key to the corresponding marks used on the die on the wafer itself

Used by classes
1
property
Code
AAD187
Data type
STRING_TYPE
Used by classes (1)

Version history5#

  1. Current rev 07
    21 Dec 2024 · 18:46 UTC by BATCH 00001336
    View on cdd.iec.ch ↗
  2. superseded rev 06
    17 Aug 2015 · 15:40 UTC by BATCH 00000917
    ↓ Version JSON
    View on cdd.iec.ch ↗
  3. superseded rev 05
    23 Jul 2015 · 11:08 UTC by BATCH 00000907
    ↓ Version JSON
    View on cdd.iec.ch ↗
  4. superseded rev 04
    22 Jul 2015 · 14:21 UTC by BATCH 00000904
    ↓ Version JSON
    View on cdd.iec.ch ↗
  5. superseded rev 03
    04 Apr 2012 · 12:47 UTC by BATCH 00000783
    ↓ Version JSON
    View on cdd.iec.ch ↗

IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.

Metadata#

Source document
IEC 62258
Version
2
Revision
7
Status
Standard
Publisher
IEC
Published in
IEC 61360-4
Responsible committee
IEC/TC 47
Change request
C00162
Dates
  • Original: 2006-11-10
  • Current version: 2011-02-15
  • Current revision: 2024-12-21