wafer mapv2rev 72011-02-15IEC 62258
wafer map
0112/2///61360_4#AAD187
reference to a document or file that contains either a map of a wafer containing die devices, indicating the quality or performance levels of each, or a key to the corresponding marks used on the die on the wafer itself
- Used by classes
- 1
- Code
AAD187- Data type
- STRING_TYPE
Version history5#
IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.
Metadata#
- Source document
- IEC 62258
- Version
- 2
- Revision
- 7
- Status
- Standard
- Publisher
- IEC
- Published in
- IEC 61360-4
- Responsible committee
- IEC/TC 47
- Change request
C00162- Dates
- Original: 2006-11-10
- Current version: 2011-02-15
- Current revision: 2024-12-21