bonding methodsv2rev 62011-02-15
bonding methods and materials
0112/2///61360_4#AAD218
description of any special bonding methods to be used, together with information on suitable bonding materials where these methods and/or materials are required for correct operation of the die device
- Used by classes
- 1
Also appears in1#
Entities with the same name in other dictionaries:
- Code
AAD218- Data type
- STRING_TYPE
Version history4#
IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.
All properties19#
- Version
- 2
- Revision
- 6
- Preferred name
- bonding methods and materials
- Short name
- bonding methods
- Definition
- description of any special bonding methods to be used, together with information on suitable bonding materials where these methods and/or materials are required for correct operation of the die device
- Definition class
- 0112/2///61360_4#AAA302die device
- Drawing reference
- M..255
- Responsible committee
- TC47/PT62258
- Publisher
- IEC 62258
- Published in
- IEC 61360-4 DB
- Published in
- NON_DEPENDENT_P_DET
- Status level
- Standard
- Version release date
- 2015-08-17
- Revision release date
- 2011-02-15
- Version initiation date
- 2015-08-17
- Original definition date
- 2007-03-02
- MDC_P022
- STRING_TYPE
- MDC_P040
- A55