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attachment limitationsv2rev 62011-02-15

attachment limitations

0112/2///61360_4#AAD219

description of any limitations on the methods or processes used for attaching the die device

Used by classes
1
property

Also appears in1#

Entities with the same name in other dictionaries:

Code
AAD219
Data type
STRING_TYPE
Used by classes (1)

Version history4#

  1. Current rev 06
    17 Aug 2015 · 15:40 UTC by BATCH 00000917
    View on cdd.iec.ch ↗
  2. superseded rev 05
    23 Jul 2015 · 11:08 UTC by BATCH 00000907
    ↓ Version JSON
    View on cdd.iec.ch ↗
  3. superseded rev 04
    22 Jul 2015 · 14:21 UTC by BATCH 00000904
    ↓ Version JSON
    View on cdd.iec.ch ↗
  4. superseded rev 03
    04 Apr 2012 · 12:47 UTC by BATCH 00000783
    ↓ Version JSON
    View on cdd.iec.ch ↗

IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.

All properties20#

Version
2
Revision
6
Preferred name
attachment limitations
Short name
attachment limitations
Definition
description of any limitations on the methods or processes used for attaching the die device
Remark
For example, any areas on the chip where it is not allowed to apply ultrasonic power or pressure
Definition class
0112/2///61360_4#AAA302die device
Drawing reference
M..255
Responsible committee
TC47/PT62258
Publisher
IEC 62258
Published in
IEC 61360-4 DB
Published in
NON_DEPENDENT_P_DET
Status level
Standard
Version release date
2015-08-17
Revision release date
2011-02-15
Version initiation date
2015-08-17
Original definition date
2007-03-02
MDC_P001_6
0112/2///61360_4#AAD219attachment limitations
MDC_P022
STRING_TYPE
MDC_P040
A55