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process limitationsv2rev 62011-02-15

process limitations

0112/2///61360_4#AAD220

description of any limitations on the processes used in bonding the die device

Used by classes
1
property
Code
AAD220
Data type
STRING_TYPE
Used by classes (1)

Version history4#

  1. Current rev 06
    17 Aug 2015 · 15:40 UTC by BATCH 00000917
    View on cdd.iec.ch ↗
  2. superseded rev 05
    23 Jul 2015 · 11:08 UTC by BATCH 00000907
    ↓ Version JSON
    View on cdd.iec.ch ↗
  3. superseded rev 04
    22 Jul 2015 · 14:21 UTC by BATCH 00000904
    ↓ Version JSON
    View on cdd.iec.ch ↗
  4. superseded rev 03
    04 Apr 2012 · 12:47 UTC by BATCH 00000783
    ↓ Version JSON
    View on cdd.iec.ch ↗

IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.

Metadata#

Remark
For example, warnings should be given of active circuitry under any bond pad.
Version
2
Revision
6
Status
Standard
Publisher
IEC 62258
Published in
IEC 61360-4 DB
Responsible committee
TC47/PT62258
Dates
  • Original: 2007-03-02
  • Current version: 2011-02-15
  • Current revision: 2015-08-17