flash memory

number of words specifying the data storage capacity of a digital memory function on an IC

maximum access time interval, from address to output, of a memory function of an IC

code identifying the storage function of a digital IC

minimum time interval during which output data continues to be valid following a change of input conditions that could cause the output data to change at the end of the interval applicable to a storage IC in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval between application of a signal that is maintained at the address input terminal and a subsequent active transition of the corresponding timing pulse of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval during which the address signal must be retained at an input terminal after the subsequent active transition of the corresponding timing signal of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval between application of a signal that is maintained at an input terminal and a subsequent active transition of the corresponding timing pulse of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval during which a signal must be retained at an input terminal after the subsequent active transition of the corresponding timing signal of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval between application of the clock signal that is maintained at an input terminal and a subsequent active transition of the corresponding timing pulse of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval during which the clock signal must be retained at an input terminal after the subsequent active transition of the corresponding timing signal of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

minimum time interval during which a signal is retained at an output terminal after the subsequent active transition of the corresponding timing signal of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

limits to the value as specified by level (minmax) of the HIGH-to-LOW or LOW-to-HIGH level transition time which must be observed at the clock input of a memory device at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

code identifying a digital function of an IC

DC voltage at the output terminal of a digital function of an integrated circuit that corresponds with a logic HIGH level, at specified conditions

value as specified by level (minTypmax) of the guaranteed HIGH-state dc output voltage of a digital function of an IC, at reference input voltages, specified supply voltage and output current, and in a temperature range between specified temperatures (T_1} and T_2})

value as specified by level (minTypmax) of the guaranteed LOW-state dc output voltage of a digital function of an IC, at reference input voltages, specified supply voltage and output current, and in a temperature range between specified temperatures (T_1} and T_2})

DC voltage at the output terminal of a digital function of an integrated circuit that corresponds with a logic LOW level, at specified conditions

maximum limiting dc input current of a digital function of an IC

maximum limiting dc output current of a digital function of an IC

DC leakage current flowing through the input terminal of a digital function of an integrated circuit, at specified conditions

maximum guaranteed HIGH-level to LOW-level transition time at the output of a digital function of an IC at specified load capacitance, supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

maximum guaranteed LOW-level to HIGH-level transition time at the output of a digital function of an IC at specified output capacitance, supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

maximum guaranteed HIGH off-state dc output current, of a 3-state digital function of an IC, at the maximum supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

maximum guaranteed LOW off-state dc output current, of a 3-state digital function of an IC, at maximum supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

LOW-level DC output current of a digital function of an integrated circuit, at specified conditions

HIGH-level DC output current of a digital function of an integrated circuit, at specified conditions

code of the numeral system of a digital signal function of an IC

number of bits per word applying to a digital function of an IC

code of the mode of control of a function of an IC

value as specified by level (minTypmax) of the HIGH-state dc input voltage, applied to a digital function of an IC at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

value as specified by level (minTypmax) of the LOW-state dc input voltage, applied to a digital function of an IC at specified supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

code of the input or output characteristic of a digital IC function

total DC supply current of a digital function of an integrated circuit in quiescent (non-switching) state, at specified conditions

maximum guaranteed additional quiescent dc supply current per input, of an HCMOS IC, at specified supply voltage, zero output current and a temperature range between specified temperatures (T_1} and T_2})

DC current flowing through the input terminal of a digital function of an integrated circuit, when the input voltage corresponds to a logic HIGH level, at specified conditions

DC current flowing through the input terminal of a digital function of an integrated circuit, when the input voltage corresponds to a logic LOW level

maximum guaranteed total HIGH-state dc supply current, of a TTL digital IC, at the maximum supply voltage

maximum guaranteed total LOW-state dc supply current of a TTL digital IC at the maximum supply voltage

maximum guaranteed total off-state dc supply current, of a 3-state TTL digital IC, at the maximum supply voltage and in a temperature range between specified temperatures (T_1} and T_2})

value as specified by level (minmax) of the output current of a digital TTL IC, when an output is short-circuited, at maximum supply voltage, and in a temperature range between specified temperatures (T_1} and T_2})

interface compatibility of the digital IC inputs and outputs with the peripheral circuits

direct supply voltage applied to an IC, as a variable

dc output current of an IC, as a variable

lower temperature T_1} of the temperature range applied to a component, as a variable

upper temperature T_2} of the temperature range applied to a component, as a variable

Load capacitance at the output of an electric, electronic or electromechanical component, as a variable

dc output voltage of an IC, as a variable

description of the intended operations performed by a die device or integrated circuit when operated under the conditions as recommended by the manufacturer

name of a file containing a model which may be used for simulating some aspect of the behaviour of an electronic device

date on which a simulator model file was created or released for use

name of a simulator software package with which a simulator model is intended to be used

version of a simulator software package with which a simulator model is intended to be used

compliance level of a simulator software package with which a simulator model is intended to be used

set containing the list of identities of the terminals or terminal groups to which a simulator model applies

nominal thickness of a semiconductor wafer containing die devices

nominal tolerance on the thickness of a semiconductor wafer containing die devices

reference to a document or file that contains either a map of a wafer containing die devices, indicating the quality or performance levels of each, or a key to the corresponding marks used on the die on the wafer itself

textual description of the shape of the bumps forming the terminals on a die device

reference to a document or file containing a graphical representation of the shape of the bumps forming the terminals on a die device

description of the processes used in attaching the bumps to a die device

code giving the sensitivity of moisture ingress for a packaged integrated circuit or am minimally-packaged die device

reference to a document or file containing a graphical representation of the outline drawing for a minimally-packaged die device

code identifying the equipment in which an application oriented IC is used

code identifying a function on an IC according to the type of signal being treated

permissible DC voltage that may be applied to the power supply pins of an integrated circuit

Number of identical functions of a multiple function component

value as specified by level (minmax) of the limiting direct input voltage applied to an IC

maximum permissible power dissipation per output of an IC at specified ambient temperature

maximum temperature of the mounting base of a transistor, diode, trigger device, optoelectronic device or IC

maximum junction temperature of a transistor, diode, trigger device, optoelectronic device or IC

code of the type of colour television transmission applying to a delay line or IC

Number of inputs of a function of an IC

IEC standard abbreviation of the name of the frequency band for the application of an electric-electronic component

IEC standard abbreviation of the type of modulation for the application of an electric-electronic component

code indicating the semiconductor technology of an IC

DC voltage range for which an integrated circuit operates normally when applied to the power supply pins

value as specified by level (minTypmax) of the direct supply current of an IC

code of the mode of operation of a function of an IC

code of the package of an IC

capacitance between the input terminal and the reference ground terminal of an integrated circuit, at specified conditions

nominal junction temperature of a transistor, diode, trigger device, optoelectronic device or integrated circuit during stress

temperature of the air or other media, in the immediate vicinity of the equipment or component

code of the category to which an electric-electronic component belongs

code of the shape of the terminals of an electric, electronic or electromechanical component

code indicating the placement of the terminals of an electric-electronic or electromechanical component

value as specified by level (miNomax) of the diameter of the terminals of an electric-electronic or electromechanical component

nominal pitch of the terminals of an electric, electronic or electromechanical component

value as specified by level (miNomax) of the length of the terminals of an electric-electronic or electromechanical component extending below the seating plane

code of the terminal material of an electric-electronic or electromechanical component

BSI code of the shape/size of an electric-electronic or electromechanical component for placement on printed circuits

maximum rms current of an electric-electronic or electromechanical component at specified ambient temperature

maximum length of the body of an electric/ electronic or electromechanical component with axial leads, including the lacquered part of the leads

maximum operating thermal resistance of an electric-electronic or electromechanical component, of a specified thermal resistance type

permissible temperature range at which the device may be stored without any voltage being applied

minimum required power dissipation derating factor of an electric-electronic or electromechanical component, at ambient temperatures higher than the rated temperature

nominal pitch of the holes of an electric/electronic or electromechanical component parallel to the x coordinate

value as specified by level (miNomax) of the length of the flange of a component in the x-direction

value as specified by level (miNomax) of the height of the flange of an electric/electronic or electromechanical component

value as specified by level (miNomax) of the diameter of the body of an electric/electronic or electromechanical component

nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the x coordinate

nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the y coordinate

nominal diameter of the pitch circle of the terminals of an electric, electronic or electromechanical component

nominal breadth of the terminals of an electric, electronic or electromechanical component

nominal thickness of the terminals of an electric, electronic or electromechanical component

nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the y coordinate

nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the x coordinate

value as specified by level (miNomax) of the diameter of the flange of an electric/electronic or electromechanical component

code of the mounting method of an electric/electronic or electromechanical component

code indicating the exit position of the terminals of an electric/electronic or electromechanical component

code indicating the exit position of the terminals of electric/electronic or electromechanical components

code of the terminal shape of an electric/electronic or electromechanical component

code of the terminal shape of an electric/electronic or electromechanical component

number of holes in an electric, electronic or electromechanical component

code of the basic aspect of the shape of an electric/electronic or electromechanical component

EIcode of the size of an electric/electronic component for placement on printed wiring board

code of the placement of an adjuster on an electric, electronic component for placement on printed-circuit boards

number of studs on an electric/electronic or electromechanical component designed for fastening

number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the x-coordinate

number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the y-coordinate

CECC code of the specification in which an electric/ electronic or electromechanical component is released under the CECC quality assessment system

permissible power which may be dissipated continuously, at normal operating conditions

code of the main functional class to which a component belongs

value as specified by level (miNomax) of the outside diameter of a component with a body of circular cross-section

IEC code of the type of temperature indicating the specific part of a component, or its environment, to which it applies

temperature of a component, or its environment, as a variable

abbreviated name of the authority for quality certification of products

value as specified by level (miNomax) of the inside diameter of a component with a body of circular cross-section

minimum temperature applied to a component during cycle stress

maximum temperature applied to a component during cycle stress

nominal ambient free air temperature applied to a component during high temperature life test

nominal value of the ambient humidity relative to saturation humidity, applied to a component during humidity resistance stress

value as specified by level (miNomax) of the breadth of the flange of a component in the y-direction

code of the shape of the body of an electric/electronic or electromechanical component

code indicating the angle of vision on a component serving as standard for describing the component

one or more characters used to identify a specific terminal of a component

mark that indicates whether the terminal pairs or terminal groups of one function or one component may be exchanged

mark that indicates whether the terminals of one function or one component may be exchanged

nominal value of the x-displacement of the centre of gravity of a component related to the reference point of that component

nominal value of the y-displacement of the centre of gravity of a component related to the reference point of that component

factor by which the rated voltage has to be multiplied to obtain the value of the test voltage to be applied to a device under test

code of the preforming of leads to create a distance between the component and the seating-plane

code of the cross-section shape of the terminals of a component

combination of the reference to a coding system for case sizes and the code of a specific case size within that system of a component

code of the type of connect node of a component

coded abbreviation of the two dimensional projection view of an item

value as specified by level (miNomax) of the distance on the x-axis of the reference point to the zero-point

value as specified by level (miNomax) of the distance on the y-axis of the reference point to the zero-point

value as specified by level (miNomax) of the distance on the z-axis of the reference point to the zero-point

value of the denominator of the ratio of the real things magnitude to the magnitude of the model

value of the angle between the orientation of the axis of a constructive solid geometry primitive and the X-axis of the placement coordinate system

value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Y-axis of the placement coordinate system

value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Z-axis of the placement coordinate system

value as specified by level (miNomax) of the distance on the y-axis of the centre of a sphere

value as specified by level (miNomax) of the distance on the z-axis of the centre of a sphere

value as specified by level (miNomax) of the length of the edge of a N-edged regular column

value as specified by level (miNomax) of the length of the inner radius of a right circular tube

value as specified by level (miNomax) of the length of the outer radius of a right circular tube

code of the type of connection a terminal or connector is being designed for

value indicating the number of corners defining the column type

nominal value of the displacement of the centre of gravity of a component in z-axis direction with respect to the reference point of the component

that part of the type number of a component which identifies its generic function

code as required by a component manufacturer or supplier to identify the component when placing an order

reference to an international, regional, national standard, regulation, directive, or organization based specification etc to which an object shall be made

name or abreviation of the authority or organization being in charge of the referred specification document

reference to an international standard describing a component

reference to a regional or national standard describing a component

MIL code of the specification in which an electric, electronic or electromechanical component is released under the MIL quality assessment system

abbreviated name of the office which has approved the safety of an electric, electronic or electromechanical component

power loss of a component with losses proportional to I² during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency

reference to a document depicting the power loss of a component with losses not proportional to I² during the state under load up to the maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency

amount of electric conducting routes of an object carrying the current, contributing to thermal losses in type and routine tests

required minimum current derating factor of an electric-electronic or electromechanical component, for a specified ambient temperature higher than the rated temperature

power consumption when the item is in a non-operating up state during non-required time and measured at rated ambient temperature and rated frequency

power loss of a component with linear losses proportional to I during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency

average ratio of the duration of energization to the total period in which intermittent or continuous or temporary duty takes place

thermal power loss caused by the over- current in a short-circuit or in a situation equivalent to a short-circuit measured at given duration and at rated ambient temperature