field-effect power transistor
field-effect transistor designed for power-signal applications, having a thermal resistance between junction and mounting base of 15 K/W or less
- Inherited
- 127
Hierarchy#
Ancestors (top) → AAA127 (highlighted) → subclasses and powertype instances. Capped at 12 each; see the full lists in the sections below.
Higher level classes5#
Declared properties2#
maximum temperature of the mounting base of a transistor, diode, trigger device, optoelectronic device or IC
code of the frequency identifying an amplifier, signal cable or transistor
Inherited properties (127) — click to expand
code indicating the type of gate of a field-effect transistor
code indicating the material type of the channel(s) of a field-effect transistor
maximum direct drain current of a field effect transistor
value as specified by level (minmax) of the direct drain current of a field-effect transistor at specified drain-source voltage and source short-circuited to the gate
maximum guaranteed drain cut-off current of a field-effect transistor at specified drain-source voltage, gate-source voltage and source-substrate voltage
value as specified by level (minTypmax) of the reverse gate current of a field-effect transistor with the drain short-circuited to the source and at specified gate-source voltage and temperature of a temperature type
maximum guaranteed source cut-off current of a field-effect transistor at specified drain-source voltage, drain-gate voltage and drain-substrate voltage
minimum guaranteed common mode rejection ratio of a dual field-effect transistor at specified drain current, drain-gate voltage and frequency
maximum limiting direct voltage between drain and source terminals of a field-effect transistor
maximum limiting direct voltage between drain and substrate of a field-effect transistor
value as specified by level (minTypmax) of the direct threshold voltage between gate and source terminals of an enhancement field-effect transistor at specified drain current and drain-source voltage
value as specified by level (minTypmax) of the gate-source cut-off voltage of a depletion field-effect transistor at specified drain current, drain-source voltage and temperature of a temperature type
maximum limiting direct voltage between source and substrate of a field-effect transistor
value as specified by level (minTypmax) of the capacitance between the drain and the gate with the input short-circuited to ac, of a field-effect transistor at specified frequency, drain-source voltage and gate-source voltage
value as specified by level (minTypmax) of the dc resistance between the drain and source terminals of a field-effect transistor with a specified gate-source voltage applied to bias the device to the on-state, a specified drain current and temperature of a temperature type
maximum small-signal resistance between the drain and source terminals of a unipolar field effect transistor with a specified gate-source voltage applied to bias the device in the on-state, and at specified drain-source voltage, source-substrate voltage and frequency
minimum dc resistance between drain and source terminals of a field-effect transistor with a specified gate-source voltage to bias the device in the off-state, and specified drain-source voltage and source-substrate voltage
value as specified by level (minTypmax) of the modulus of the transfer admittance of a field effect transistor at specified frequency, drain current, gate-source voltage and drain-source voltage
maximum input capacitance at the gate of an N-channel field-effect transistor at specified drain current, drain-source voltage, gate-source voltage and frequency
value as specified by level (minTypmax) of the nominal value of the real part of the transfer admittance of a forward biased field-effect transistor at specified drain current and drain-source voltage
code of the signal handling type of a transistor
value as specified by level (minTypmax) of the guaranteed capacitance between gate and source connections, with drain-source connections short-circuited for ac voltage, of a field-effect transistor at specified frequency, drain-source voltage, and gate-source voltage
value as specified by level (minTypmax) of the guaranteed capacitance between drain and source connections, with gate-source connections short-circuited for ac voltage, of a field-effect transistor at specified frequency, drain-source voltage, and gate-source voltage
maximum limiting direct voltage between gate and source terminals of a field-effect transistor
maximum junction temperature of a transistor, diode, trigger device, optoelectronic device or IC
code of the technology to which a transistor belongs
IEC standard abbreviation of the name of the frequency band for the application of an electric-electronic component
IEC standard abbreviation of the type of modulation for the application of an electric-electronic component
Type number of the nearest conventional type, with comparable electrical specification, as the surface-mounted diode or transistor under consideration
code of the envelope type of a transistor
manufacturer's type number code of a transistor with reverse polarity, complementary to the transistor under consideration
nominal junction temperature of a transistor, diode, trigger device, optoelectronic device or integrated circuit during stress
code of the category to which an electric-electronic component belongs
code of the shape of the terminals of an electric, electronic or electromechanical component
code indicating the placement of the terminals of an electric-electronic or electromechanical component
value as specified by level (miNomax) of the diameter of the terminals of an electric-electronic or electromechanical component
nominal pitch of the terminals of an electric, electronic or electromechanical component
value as specified by level (miNomax) of the length of the terminals of an electric-electronic or electromechanical component extending below the seating plane
code of the terminal material of an electric-electronic or electromechanical component
BSI code of the shape/size of an electric-electronic or electromechanical component for placement on printed circuits
maximum rms current of an electric-electronic or electromechanical component at specified ambient temperature
maximum length of the body of an electric/ electronic or electromechanical component with axial leads, including the lacquered part of the leads
maximum operating thermal resistance of an electric-electronic or electromechanical component, of a specified thermal resistance type
permissible temperature range at which the device may be stored without any voltage being applied
minimum required power dissipation derating factor of an electric-electronic or electromechanical component, at ambient temperatures higher than the rated temperature
nominal pitch of the holes of an electric/electronic or electromechanical component parallel to the x coordinate
value as specified by level (miNomax) of the length of the flange of a component in the x-direction
value as specified by level (miNomax) of the height of the flange of an electric/electronic or electromechanical component
value as specified by level (miNomax) of the diameter of the body of an electric/electronic or electromechanical component
nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the x coordinate
nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the y coordinate
nominal diameter of the pitch circle of the terminals of an electric, electronic or electromechanical component
nominal breadth of the terminals of an electric, electronic or electromechanical component
nominal thickness of the terminals of an electric, electronic or electromechanical component
nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the y coordinate
nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the x coordinate
value as specified by level (miNomax) of the diameter of the flange of an electric/electronic or electromechanical component
code of the mounting method of an electric/electronic or electromechanical component
code indicating the exit position of the terminals of an electric/electronic or electromechanical component
code indicating the exit position of the terminals of electric/electronic or electromechanical components
code of the terminal shape of an electric/electronic or electromechanical component
code of the terminal shape of an electric/electronic or electromechanical component
number of holes in an electric, electronic or electromechanical component
code of the basic aspect of the shape of an electric/electronic or electromechanical component
EIcode of the size of an electric/electronic component for placement on printed wiring board
code of the placement of an adjuster on an electric, electronic component for placement on printed-circuit boards
number of studs on an electric/electronic or electromechanical component designed for fastening
number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the x-coordinate
number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the y-coordinate
CECC code of the specification in which an electric/ electronic or electromechanical component is released under the CECC quality assessment system
permissible power which may be dissipated continuously, at normal operating conditions
code of the main functional class to which a component belongs
value as specified by level (miNomax) of the outside diameter of a component with a body of circular cross-section
IEC code of the type of temperature indicating the specific part of a component, or its environment, to which it applies
temperature of a component, or its environment, as a variable
abbreviated name of the authority for quality certification of products
value as specified by level (miNomax) of the inside diameter of a component with a body of circular cross-section
minimum temperature applied to a component during cycle stress
maximum temperature applied to a component during cycle stress
nominal ambient free air temperature applied to a component during high temperature life test
nominal value of the ambient humidity relative to saturation humidity, applied to a component during humidity resistance stress
value as specified by level (miNomax) of the breadth of the flange of a component in the y-direction
code of the shape of the body of an electric/electronic or electromechanical component
code indicating the angle of vision on a component serving as standard for describing the component
one or more characters used to identify a specific terminal of a component
mark that indicates whether the terminal pairs or terminal groups of one function or one component may be exchanged
mark that indicates whether the terminals of one function or one component may be exchanged
nominal value of the x-displacement of the centre of gravity of a component related to the reference point of that component
nominal value of the y-displacement of the centre of gravity of a component related to the reference point of that component
factor by which the rated voltage has to be multiplied to obtain the value of the test voltage to be applied to a device under test
code of the preforming of leads to create a distance between the component and the seating-plane
code of the cross-section shape of the terminals of a component
combination of the reference to a coding system for case sizes and the code of a specific case size within that system of a component
code of the type of connect node of a component
coded abbreviation of the two dimensional projection view of an item
value as specified by level (miNomax) of the distance on the x-axis of the reference point to the zero-point
value as specified by level (miNomax) of the distance on the y-axis of the reference point to the zero-point
value as specified by level (miNomax) of the distance on the z-axis of the reference point to the zero-point
value of the denominator of the ratio of the real things magnitude to the magnitude of the model
value of the angle between the orientation of the axis of a constructive solid geometry primitive and the X-axis of the placement coordinate system
value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Y-axis of the placement coordinate system
value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Z-axis of the placement coordinate system
value as specified by level (miNomax) of the distance on the y-axis of the centre of a sphere
value as specified by level (miNomax) of the distance on the z-axis of the centre of a sphere
value as specified by level (miNomax) of the length of the edge of a N-edged regular column
value as specified by level (miNomax) of the length of the inner radius of a right circular tube
value as specified by level (miNomax) of the length of the outer radius of a right circular tube
code of the type of connection a terminal or connector is being designed for
value indicating the number of corners defining the column type
nominal value of the displacement of the centre of gravity of a component in z-axis direction with respect to the reference point of the component
that part of the type number of a component which identifies its generic function
code as required by a component manufacturer or supplier to identify the component when placing an order
reference to an international, regional, national standard, regulation, directive, or organization based specification etc to which an object shall be made
name or abreviation of the authority or organization being in charge of the referred specification document
reference to an international standard describing a component
reference to a regional or national standard describing a component
MIL code of the specification in which an electric, electronic or electromechanical component is released under the MIL quality assessment system
abbreviated name of the office which has approved the safety of an electric, electronic or electromechanical component
ADA084ADA084power loss of a component with losses proportional to I² during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency
reference to a document depicting the power loss of a component with losses not proportional to I² during the state under load up to the maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency
amount of electric conducting routes of an object carrying the current, contributing to thermal losses in type and routine tests
required minimum current derating factor of an electric-electronic or electromechanical component, for a specified ambient temperature higher than the rated temperature
power consumption when the item is in a non-operating up state during non-required time and measured at rated ambient temperature and rated frequency
power loss of a component with linear losses proportional to I during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency
average ratio of the duration of energization to the total period in which intermittent or continuous or temporary duty takes place
thermal power loss caused by the over- current in a short-circuit or in a situation equivalent to a short-circuit measured at given duration and at rated ambient temperature
Metadata#
- Synonyms
- power
- Version
- 1
- Revision
- 4
- Status
- Standard
- Publisher
- IEC
- Published in
- IEC 61360-4
- Responsible committee
- IEC/SC 3D
- Change request
C00115- Dates
- Original: 2010-11-11
- Current version: 2011-08-31
- Current revision: 2023-04-17
Full source data#
Every key from the original .xls export, including multilingual variants, status, publisher, committee, and workbook-specific codes.
Raw properties (20 keys from source .xls) — click to expand
- C002
- C00115
- C011
- IEC
- C012
- IEC 61360-4
- C016
- Standard
- C021
- 0112/2///61360_4#AAF146
- MDC_P001_5
- 0112/2///61360_4#AAA127
- MDC_P002_1
- 1
- MDC_P002_2
- 4
- MDC_P003_0
- 2023-04-17
- MDC_P003_1
- 2010-11-11
- MDC_P003_2
- 2011-08-31
- MDC_P003_3
- 2023-04-17
- MDC_P004.en
- field-effect power transistor
- MDC_P005.en
- POWT
- MDC_P006.en
- field-effect transistor designed for power-signal applications, having a thermal resistance between junction and mounting base of 15 K/W or less
- MDC_P007.en
- power
- MDC_P010
- 0112/2///61360_4#AAA126
- MDC_P011
- ITEM_CLASS
- MDC_P012
- IEC/SC 3D
- MDC_P014
- {0112/2///61360_4#AAE336,0112/2///61360_4#AAF146}
Version history4#
IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.