two-sided bare die device

code based on the IEC 60191 code to identify the die

name or identifier given to the die by the manufacturer

code given by the manufacturer to identify the version of the die

mnemonic code for the physical form in which the die or wafer is supplied

code or designation given by a manufacturer to the schedule of tests applied to assess the performance characteristics and to conduct burn-in for a die

fraction of die as specified by level (minTyp) which function according to specification on delivery to a customer

description of the physical form of the die including information on solder bumps and lead frame where applicable

name given to the signal appearing at the terminal of a device

code of the type of signal associated with a terminal

reference to a definition of a power supply or logic signal connection

code of the direction of signal flow at a terminal

codes which indicate connection interchangeability of a terminal with other terminals

code indicating whether a power supply is fixed or variable

value as specified by level (miNomax) of a dc voltage connected to the supply terminal of an integrated circuit

absolute maximum value of the current that should flow through a single bond site on a supply pad

name given to a terminal for the supply of power to a device

total value as specified by level (typmax) of the dc current passing through all terminals of an integrated circuit connected to the same supply voltage

mnemonic code for the form of packing used for the supply of a die or wafer

mnemonic code for the form in which the die is supplied either in wafer form or as individual dice

description of the procedures used in the test and evaluation of a die

nominal value of the step interval of die patterns on a wafer measured in the direction of the x axis of the coordinate system established for the wafer

nominal value of the step interval of die patterns on a wafer measured in the direction of the y axis of the coordinate system established for the wafer

perpendicular distance between the two plane faces of a die or wafer

short title for the procedures used in the test and evaluation of a die

short title for the physical form of a die or wafer

description of the physical form of a die or wafer

short title for the form in which a die or wafer is supplied

description of the form in which a die or wafer is supplied

short title for the form of packing used for supply of a die or wafer

description of the form of packing used for the supply of a die or wafer

single-character code giving the range of actual yield figures for a die

tolerance on the length and width dimensions of a die

tolerance on the thickness of a die or wafer

reference to a file or document containing a picture of the die which shows the positions of all pads

nominal distance measured in the x direction of the geometric centre on the surface of a die from the geometric origin

nominal distance measured in the y direction of the geometric centre on the surface of a die from the geometric origin

average fraction of die which which may be expected to be defective on delivery to a customer

code for the basic test procedures applied to a die or wafer

code for the basic temperature specification for tests applied to a die or wafer

code for the basic options of test, inspection and burn-in applied to a die or wafer

code to indicate the level of conformity with a relevant part of ES 59008 as defined in ES 59008-1

original manufacturer of the die device

organisation that supplied the die device, where different from the original manufacturer

organisation that supplied the data on the die device, where different from the original manufacturer

manufacturer's type number or part name for a packaged part equivalent to the die device

code that specifies the geometric view that shall apply to all geometric shapes used in drawings of a die device

total number of terminals on a die device

maximum power dissipated by a semiconductor device under typical worst-case conditions

code to indicate the availability of reliability information for a die device

code to indicate the maturity of the production process for a die device

name given to identify a particular fiducial

name of a file containing an image of the fiducial on the die device

nominal length of a fiducial measured in a direction parallel to the x-axis

nominal width of a fiducial measured in a direction parallel to the y-axis

nominal value of the x coordinate of the geometric centre of a fiducial referred to the geometric origin of the die as origin

nominal value of the y coordinate of the geometric centre of a fiducial referred to the geometric origin of the die as origin

orientation code for a pad related to reference axes

nominal length of the step-and-repeat dimensions of die on a wafer in the x direction

nominal length of the step-and-repeat dimensions of die on a wafer in the x direction

nominal gross number of whole and viable die on a wafer

code for the type of index present on a wafer which is used as a reference feature to determine its orientation

nominal angle between the x-axis for the die and a radius drawn from the centre of the wafer to the mid-point of the index feature

nominal length of the step-and-repeat dimensions of a reticule containing die on a wafer in the x direction

nominal length of the step-and-repeat dimensions of a reticule containing die on a wafer in the y direction

nominal gross number of whole and viable die in a single reticule on a wafer

description of the metal layers forming the pad on a die device to which external connection is made

maximum temperature that may be applied to a die device during assembly

number of actual terminals on a minimally-packaged device

a description of the disposition of the terminals on a minimally-packaged device that will allow a user to determine the position of all terminals on the device

description of the shape and size of all terminals on a minimally-packaged device

maximum overall length of a minimally-packaged die device

maximum overall width of a minimally-packaged die device

quality level of a component as supplied by the manufacturer

description of the tests and procedures used to verify the outgoing quality of a component

list of the electrical parameters for which tests were made in assessing the outgoing quality of a component, together with the test limits for each

list of all the quality assurance standards for which compliance is claimed, together with the compliance level for each

description of additional screening, including burn-in, that has been applied to a component before delivery

description of the status of the component within that product's life cycle

description and explanation of designed-in testability features which may be needed and appropriate for customer testing of a die device

product-specific information which is relevant to electrical testing by the user

estimated figure for the reliability of a component as supplied by the manufacturer

description of the methods used in arriving at the estimate of reliability, including the procedures that may be used to determine reliability estimates under other conditions than those for which the estimate was given

reference to a document or other source which contains further information on making, using and extrapolating a reliability estimate

description of the specific issues that affect the maximum duration of storage of a die device together with the conditions under which this storage period is valid

description of the storage conditions for die devices that have been stored for an extended period

description of any procedures a user may require or precautions that must be observed when assembling a die device

description of any special or abnormal attach methods and materials, including pre-conditioning, that are required for proper assembly of a die device

description of any special bonding methods to be used, together with information on suitable bonding materials where these methods and/or materials are required for correct operation of the die device

description of any limitations on the methods or processes used for attaching the die device

description of any limitations on the processes used in bonding the die device

description of any limitations on the conditions under which a die device is stored or the length of time for which it may be stored

maximum time for which the maximum temperature may be applied to a die device during assembly

units in which the reliability estimate of a component is given

conditions under which a reliability estimate for a component was made

units in which the outgoing quality level of a component is given

description of the intended operations performed by a die device or integrated circuit when operated under the conditions as recommended by the manufacturer

name of a file containing a model which may be used for simulating some aspect of the behaviour of an electronic device

date on which a simulator model file was created or released for use

name of a simulator software package with which a simulator model is intended to be used

version of a simulator software package with which a simulator model is intended to be used

compliance level of a simulator software package with which a simulator model is intended to be used

set containing the list of identities of the terminals or terminal groups to which a simulator model applies

nominal thickness of a semiconductor wafer containing die devices

nominal tolerance on the thickness of a semiconductor wafer containing die devices

reference to a document or file that contains either a map of a wafer containing die devices, indicating the quality or performance levels of each, or a key to the corresponding marks used on the die on the wafer itself

textual description of the shape of the bumps forming the terminals on a die device

reference to a document or file containing a graphical representation of the shape of the bumps forming the terminals on a die device

description of the processes used in attaching the bumps to a die device

code giving the sensitivity of moisture ingress for a packaged integrated circuit or am minimally-packaged die device

reference to a document or file containing a graphical representation of the outline drawing for a minimally-packaged die device

code of the type of geometry possessed by an electric-electronic component

code identifying the equipment in which an application oriented IC is used

code identifying a function on an IC according to the type of signal being treated

permissible DC voltage that may be applied to the power supply pins of an integrated circuit

Number of identical functions of a multiple function component

value as specified by level (minmax) of the limiting direct input voltage applied to an IC

maximum permissible power dissipation per output of an IC at specified ambient temperature

maximum temperature of the mounting base of a transistor, diode, trigger device, optoelectronic device or IC

maximum junction temperature of a transistor, diode, trigger device, optoelectronic device or IC

code of the type of colour television transmission applying to a delay line or IC

Number of inputs of a function of an IC

IEC standard abbreviation of the name of the frequency band for the application of an electric-electronic component

IEC standard abbreviation of the type of modulation for the application of an electric-electronic component

code indicating the semiconductor technology of an IC

DC voltage range for which an integrated circuit operates normally when applied to the power supply pins

value as specified by level (minTypmax) of the direct supply current of an IC

code of the mode of operation of a function of an IC

code of the package of an IC

capacitance between the input terminal and the reference ground terminal of an integrated circuit, at specified conditions

nominal junction temperature of a transistor, diode, trigger device, optoelectronic device or integrated circuit during stress

temperature of the air or other media, in the immediate vicinity of the equipment or component

code of the category to which an electric-electronic component belongs

code of the shape of the terminals of an electric, electronic or electromechanical component

code indicating the placement of the terminals of an electric-electronic or electromechanical component

value as specified by level (miNomax) of the diameter of the terminals of an electric-electronic or electromechanical component

nominal pitch of the terminals of an electric, electronic or electromechanical component

value as specified by level (miNomax) of the length of the terminals of an electric-electronic or electromechanical component extending below the seating plane

code of the terminal material of an electric-electronic or electromechanical component

BSI code of the shape/size of an electric-electronic or electromechanical component for placement on printed circuits

maximum rms current of an electric-electronic or electromechanical component at specified ambient temperature

maximum length of the body of an electric/ electronic or electromechanical component with axial leads, including the lacquered part of the leads

maximum operating thermal resistance of an electric-electronic or electromechanical component, of a specified thermal resistance type

permissible temperature range at which the device may be stored without any voltage being applied

minimum required power dissipation derating factor of an electric-electronic or electromechanical component, at ambient temperatures higher than the rated temperature

nominal pitch of the holes of an electric/electronic or electromechanical component parallel to the x coordinate

value as specified by level (miNomax) of the length of the flange of a component in the x-direction

value as specified by level (miNomax) of the height of the flange of an electric/electronic or electromechanical component

value as specified by level (miNomax) of the diameter of the body of an electric/electronic or electromechanical component

nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the x coordinate

nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the y coordinate

nominal diameter of the pitch circle of the terminals of an electric, electronic or electromechanical component

nominal breadth of the terminals of an electric, electronic or electromechanical component

nominal thickness of the terminals of an electric, electronic or electromechanical component

nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the y coordinate

nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the x coordinate

value as specified by level (miNomax) of the diameter of the flange of an electric/electronic or electromechanical component

code of the mounting method of an electric/electronic or electromechanical component

code indicating the exit position of the terminals of an electric/electronic or electromechanical component

code indicating the exit position of the terminals of electric/electronic or electromechanical components

code of the terminal shape of an electric/electronic or electromechanical component

code of the terminal shape of an electric/electronic or electromechanical component

number of holes in an electric, electronic or electromechanical component

code of the basic aspect of the shape of an electric/electronic or electromechanical component

EIcode of the size of an electric/electronic component for placement on printed wiring board

code of the placement of an adjuster on an electric, electronic component for placement on printed-circuit boards

number of studs on an electric/electronic or electromechanical component designed for fastening

number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the x-coordinate

number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the y-coordinate

CECC code of the specification in which an electric/ electronic or electromechanical component is released under the CECC quality assessment system

permissible power which may be dissipated continuously, at normal operating conditions

code of the main functional class to which a component belongs

value as specified by level (miNomax) of the outside diameter of a component with a body of circular cross-section

IEC code of the type of temperature indicating the specific part of a component, or its environment, to which it applies

temperature of a component, or its environment, as a variable

abbreviated name of the authority for quality certification of products

value as specified by level (miNomax) of the inside diameter of a component with a body of circular cross-section

minimum temperature applied to a component during cycle stress

maximum temperature applied to a component during cycle stress

nominal ambient free air temperature applied to a component during high temperature life test

nominal value of the ambient humidity relative to saturation humidity, applied to a component during humidity resistance stress

value as specified by level (miNomax) of the breadth of the flange of a component in the y-direction

code of the shape of the body of an electric/electronic or electromechanical component

code indicating the angle of vision on a component serving as standard for describing the component

one or more characters used to identify a specific terminal of a component

mark that indicates whether the terminal pairs or terminal groups of one function or one component may be exchanged

mark that indicates whether the terminals of one function or one component may be exchanged

nominal value of the x-displacement of the centre of gravity of a component related to the reference point of that component

nominal value of the y-displacement of the centre of gravity of a component related to the reference point of that component

factor by which the rated voltage has to be multiplied to obtain the value of the test voltage to be applied to a device under test

code of the preforming of leads to create a distance between the component and the seating-plane

code of the cross-section shape of the terminals of a component

combination of the reference to a coding system for case sizes and the code of a specific case size within that system of a component

code of the type of connect node of a component

coded abbreviation of the two dimensional projection view of an item

value as specified by level (miNomax) of the distance on the x-axis of the reference point to the zero-point

value as specified by level (miNomax) of the distance on the y-axis of the reference point to the zero-point

value as specified by level (miNomax) of the distance on the z-axis of the reference point to the zero-point

value of the denominator of the ratio of the real things magnitude to the magnitude of the model

value of the angle between the orientation of the axis of a constructive solid geometry primitive and the X-axis of the placement coordinate system

value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Y-axis of the placement coordinate system

value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Z-axis of the placement coordinate system

value as specified by level (miNomax) of the distance on the y-axis of the centre of a sphere

value as specified by level (miNomax) of the distance on the z-axis of the centre of a sphere

value as specified by level (miNomax) of the length of the edge of a N-edged regular column

value as specified by level (miNomax) of the length of the inner radius of a right circular tube

value as specified by level (miNomax) of the length of the outer radius of a right circular tube

code of the type of connection a terminal or connector is being designed for

value indicating the number of corners defining the column type

nominal value of the displacement of the centre of gravity of a component in z-axis direction with respect to the reference point of the component

that part of the type number of a component which identifies its generic function

code as required by a component manufacturer or supplier to identify the component when placing an order

reference to an international, regional, national standard, regulation, directive, or organization based specification etc to which an object shall be made

name or abreviation of the authority or organization being in charge of the referred specification document

reference to an international standard describing a component

reference to a regional or national standard describing a component

MIL code of the specification in which an electric, electronic or electromechanical component is released under the MIL quality assessment system

abbreviated name of the office which has approved the safety of an electric, electronic or electromechanical component

power loss of a component with losses proportional to I² during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency

reference to a document depicting the power loss of a component with losses not proportional to I² during the state under load up to the maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency

amount of electric conducting routes of an object carrying the current, contributing to thermal losses in type and routine tests

required minimum current derating factor of an electric-electronic or electromechanical component, for a specified ambient temperature higher than the rated temperature

power consumption when the item is in a non-operating up state during non-required time and measured at rated ambient temperature and rated frequency

power loss of a component with linear losses proportional to I during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency

average ratio of the duration of energization to the total period in which intermittent or continuous or temporary duty takes place

thermal power loss caused by the over- current in a short-circuit or in a situation equivalent to a short-circuit measured at given duration and at rated ambient temperature