die device
bare semiconductor die or wafer, with or without connection structures, or minimally-packaged dies or wafers
- Inherited
- 131
Hierarchy#
Ancestors (top) → AAA302 (highlighted) → subclasses and powertype instances. Capped at 12 each; see the full lists in the sections below.
Higher level classes2#
Declared properties96#
code based on the IEC 60191 code to identify the die
name or identifier given to the die by the manufacturer
code given by the manufacturer to identify the version of the die
mnemonic code for the physical form in which the die or wafer is supplied
code or designation given by a manufacturer to the schedule of tests applied to assess the performance characteristics and to conduct burn-in for a die
fraction of die as specified by level (minTyp) which function according to specification on delivery to a customer
description of the physical form of the die including information on solder bumps and lead frame where applicable
AAD011AAD011name given to the signal appearing at the terminal of a device
code of the type of signal associated with a terminal
reference to a definition of a power supply or logic signal connection
code of the direction of signal flow at a terminal
codes which indicate connection interchangeability of a terminal with other terminals
code indicating whether a power supply is fixed or variable
value as specified by level (miNomax) of a dc voltage connected to the supply terminal of an integrated circuit
absolute maximum value of the current that should flow through a single bond site on a supply pad
name given to a terminal for the supply of power to a device
total value as specified by level (typmax) of the dc current passing through all terminals of an integrated circuit connected to the same supply voltage
mnemonic code for the form of packing used for the supply of a die or wafer
mnemonic code for the form in which the die is supplied either in wafer form or as individual dice
description of the procedures used in the test and evaluation of a die
nominal value of the step interval of die patterns on a wafer measured in the direction of the x axis of the coordinate system established for the wafer
nominal value of the step interval of die patterns on a wafer measured in the direction of the y axis of the coordinate system established for the wafer
perpendicular distance between the two plane faces of a die or wafer
short title for the procedures used in the test and evaluation of a die
short title for the physical form of a die or wafer
description of the physical form of a die or wafer
short title for the form in which a die or wafer is supplied
description of the form in which a die or wafer is supplied
short title for the form of packing used for supply of a die or wafer
description of the form of packing used for the supply of a die or wafer
single-character code giving the range of actual yield figures for a die
tolerance on the length and width dimensions of a die
tolerance on the thickness of a die or wafer
reference to a file or document containing a picture of the die which shows the positions of all pads
nominal distance measured in the x direction of the geometric centre on the surface of a die from the geometric origin
nominal distance measured in the y direction of the geometric centre on the surface of a die from the geometric origin
average fraction of die which which may be expected to be defective on delivery to a customer
code for the basic test procedures applied to a die or wafer
code for the basic temperature specification for tests applied to a die or wafer
code for the basic options of test, inspection and burn-in applied to a die or wafer
code to indicate the level of conformity with a relevant part of ES 59008 as defined in ES 59008-1
original manufacturer of the die device
organisation that supplied the die device, where different from the original manufacturer
organisation that supplied the data on the die device, where different from the original manufacturer
manufacturer's type number or part name for a packaged part equivalent to the die device
code that specifies the geometric view that shall apply to all geometric shapes used in drawings of a die device
total number of terminals on a die device
maximum power dissipated by a semiconductor device under typical worst-case conditions
code to indicate the availability of reliability information for a die device
code to indicate the maturity of the production process for a die device
name given to identify a particular fiducial
name of a file containing an image of the fiducial on the die device
nominal length of a fiducial measured in a direction parallel to the x-axis
nominal width of a fiducial measured in a direction parallel to the y-axis
nominal value of the x coordinate of the geometric centre of a fiducial referred to the geometric origin of the die as origin
nominal value of the y coordinate of the geometric centre of a fiducial referred to the geometric origin of the die as origin
orientation code for a pad related to reference axes
nominal length of the step-and-repeat dimensions of die on a wafer in the x direction
nominal length of the step-and-repeat dimensions of die on a wafer in the x direction
nominal gross number of whole and viable die on a wafer
code for the type of index present on a wafer which is used as a reference feature to determine its orientation
nominal angle between the x-axis for the die and a radius drawn from the centre of the wafer to the mid-point of the index feature
nominal length of the step-and-repeat dimensions of a reticule containing die on a wafer in the x direction
nominal length of the step-and-repeat dimensions of a reticule containing die on a wafer in the y direction
nominal gross number of whole and viable die in a single reticule on a wafer
description of the metal layers forming the pad on a die device to which external connection is made
maximum temperature that may be applied to a die device during assembly
maximum time for which the maximum temperature may be applied to a die device during assembly
number of actual terminals on a minimally-packaged device
a description of the disposition of the terminals on a minimally-packaged device that will allow a user to determine the position of all terminals on the device
description of the shape and size of all terminals on a minimally-packaged device
maximum overall length of a minimally-packaged die device
maximum overall width of a minimally-packaged die device
quality level of a component as supplied by the manufacturer
units in which the outgoing quality level of a component is given
description of the tests and procedures used to verify the outgoing quality of a component
list of the electrical parameters for which tests were made in assessing the outgoing quality of a component, together with the test limits for each
list of all the quality assurance standards for which compliance is claimed, together with the compliance level for each
description of additional screening, including burn-in, that has been applied to a component before delivery
description of the status of the component within that product's life cycle
description and explanation of designed-in testability features which may be needed and appropriate for customer testing of a die device
product-specific information which is relevant to electrical testing by the user
estimated figure for the reliability of a component as supplied by the manufacturer
units in which the reliability estimate of a component is given
conditions under which a reliability estimate for a component was made
description of the methods used in arriving at the estimate of reliability, including the procedures that may be used to determine reliability estimates under other conditions than those for which the estimate was given
reference to a document or other source which contains further information on making, using and extrapolating a reliability estimate
description of the specific issues that affect the maximum duration of storage of a die device together with the conditions under which this storage period is valid
description of the storage conditions for die devices that have been stored for an extended period
description of any procedures a user may require or precautions that must be observed when assembling a die device
description of any special or abnormal attach methods and materials, including pre-conditioning, that are required for proper assembly of a die device
description of any special bonding methods to be used, together with information on suitable bonding materials where these methods and/or materials are required for correct operation of the die device
description of any limitations on the methods or processes used for attaching the die device
description of any limitations on the processes used in bonding the die device
description of any limitations on the conditions under which a die device is stored or the length of time for which it may be stored
Inherited properties (131) — click to expand
description of the intended operations performed by a die device or integrated circuit when operated under the conditions as recommended by the manufacturer
name of a file containing a model which may be used for simulating some aspect of the behaviour of an electronic device
date on which a simulator model file was created or released for use
name of a simulator software package with which a simulator model is intended to be used
version of a simulator software package with which a simulator model is intended to be used
compliance level of a simulator software package with which a simulator model is intended to be used
set containing the list of identities of the terminals or terminal groups to which a simulator model applies
nominal thickness of a semiconductor wafer containing die devices
nominal tolerance on the thickness of a semiconductor wafer containing die devices
reference to a document or file that contains either a map of a wafer containing die devices, indicating the quality or performance levels of each, or a key to the corresponding marks used on the die on the wafer itself
textual description of the shape of the bumps forming the terminals on a die device
reference to a document or file containing a graphical representation of the shape of the bumps forming the terminals on a die device
description of the processes used in attaching the bumps to a die device
code giving the sensitivity of moisture ingress for a packaged integrated circuit or am minimally-packaged die device
reference to a document or file containing a graphical representation of the outline drawing for a minimally-packaged die device
code of the type of geometry possessed by an electric-electronic component
code identifying the equipment in which an application oriented IC is used
code identifying a function on an IC according to the type of signal being treated
permissible DC voltage that may be applied to the power supply pins of an integrated circuit
Number of identical functions of a multiple function component
value as specified by level (minmax) of the limiting direct input voltage applied to an IC
maximum permissible power dissipation per output of an IC at specified ambient temperature
maximum temperature of the mounting base of a transistor, diode, trigger device, optoelectronic device or IC
maximum junction temperature of a transistor, diode, trigger device, optoelectronic device or IC
code of the type of colour television transmission applying to a delay line or IC
Number of inputs of a function of an IC
IEC standard abbreviation of the name of the frequency band for the application of an electric-electronic component
IEC standard abbreviation of the type of modulation for the application of an electric-electronic component
code indicating the semiconductor technology of an IC
DC voltage range for which an integrated circuit operates normally when applied to the power supply pins
value as specified by level (minTypmax) of the direct supply current of an IC
code of the mode of operation of a function of an IC
code of the package of an IC
capacitance between the input terminal and the reference ground terminal of an integrated circuit, at specified conditions
nominal junction temperature of a transistor, diode, trigger device, optoelectronic device or integrated circuit during stress
temperature of the air or other media, in the immediate vicinity of the equipment or component
code of the category to which an electric-electronic component belongs
code of the shape of the terminals of an electric, electronic or electromechanical component
code indicating the placement of the terminals of an electric-electronic or electromechanical component
value as specified by level (miNomax) of the diameter of the terminals of an electric-electronic or electromechanical component
nominal pitch of the terminals of an electric, electronic or electromechanical component
value as specified by level (miNomax) of the length of the terminals of an electric-electronic or electromechanical component extending below the seating plane
code of the terminal material of an electric-electronic or electromechanical component
BSI code of the shape/size of an electric-electronic or electromechanical component for placement on printed circuits
maximum rms current of an electric-electronic or electromechanical component at specified ambient temperature
maximum length of the body of an electric/ electronic or electromechanical component with axial leads, including the lacquered part of the leads
maximum operating thermal resistance of an electric-electronic or electromechanical component, of a specified thermal resistance type
permissible temperature range at which the device may be stored without any voltage being applied
minimum required power dissipation derating factor of an electric-electronic or electromechanical component, at ambient temperatures higher than the rated temperature
nominal pitch of the holes of an electric/electronic or electromechanical component parallel to the x coordinate
value as specified by level (miNomax) of the length of the flange of a component in the x-direction
value as specified by level (miNomax) of the height of the flange of an electric/electronic or electromechanical component
value as specified by level (miNomax) of the diameter of the body of an electric/electronic or electromechanical component
nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the x coordinate
nominal pitch of the terminals of an electric/electronic or electromechanical component parallel to the y coordinate
nominal diameter of the pitch circle of the terminals of an electric, electronic or electromechanical component
nominal breadth of the terminals of an electric, electronic or electromechanical component
nominal thickness of the terminals of an electric, electronic or electromechanical component
nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the y coordinate
nominal offset of the terminals of an electric, electronic or electromechanical component parallel to the x coordinate
value as specified by level (miNomax) of the diameter of the flange of an electric/electronic or electromechanical component
code of the mounting method of an electric/electronic or electromechanical component
code indicating the exit position of the terminals of an electric/electronic or electromechanical component
code indicating the exit position of the terminals of electric/electronic or electromechanical components
code of the terminal shape of an electric/electronic or electromechanical component
code of the terminal shape of an electric/electronic or electromechanical component
number of holes in an electric, electronic or electromechanical component
code of the basic aspect of the shape of an electric/electronic or electromechanical component
EIcode of the size of an electric/electronic component for placement on printed wiring board
code of the placement of an adjuster on an electric, electronic component for placement on printed-circuit boards
number of studs on an electric/electronic or electromechanical component designed for fastening
number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the x-coordinate
number of pitches between the terminals of an electric/electronic or electromechanical component parallel to the y-coordinate
CECC code of the specification in which an electric/ electronic or electromechanical component is released under the CECC quality assessment system
permissible power which may be dissipated continuously, at normal operating conditions
code of the main functional class to which a component belongs
value as specified by level (miNomax) of the outside diameter of a component with a body of circular cross-section
IEC code of the type of temperature indicating the specific part of a component, or its environment, to which it applies
temperature of a component, or its environment, as a variable
abbreviated name of the authority for quality certification of products
value as specified by level (miNomax) of the inside diameter of a component with a body of circular cross-section
minimum temperature applied to a component during cycle stress
maximum temperature applied to a component during cycle stress
nominal ambient free air temperature applied to a component during high temperature life test
nominal value of the ambient humidity relative to saturation humidity, applied to a component during humidity resistance stress
value as specified by level (miNomax) of the breadth of the flange of a component in the y-direction
code of the shape of the body of an electric/electronic or electromechanical component
code indicating the angle of vision on a component serving as standard for describing the component
one or more characters used to identify a specific terminal of a component
mark that indicates whether the terminal pairs or terminal groups of one function or one component may be exchanged
mark that indicates whether the terminals of one function or one component may be exchanged
nominal value of the x-displacement of the centre of gravity of a component related to the reference point of that component
nominal value of the y-displacement of the centre of gravity of a component related to the reference point of that component
factor by which the rated voltage has to be multiplied to obtain the value of the test voltage to be applied to a device under test
code of the preforming of leads to create a distance between the component and the seating-plane
code of the cross-section shape of the terminals of a component
combination of the reference to a coding system for case sizes and the code of a specific case size within that system of a component
code of the type of connect node of a component
coded abbreviation of the two dimensional projection view of an item
value as specified by level (miNomax) of the distance on the x-axis of the reference point to the zero-point
value as specified by level (miNomax) of the distance on the y-axis of the reference point to the zero-point
value as specified by level (miNomax) of the distance on the z-axis of the reference point to the zero-point
value of the denominator of the ratio of the real things magnitude to the magnitude of the model
value of the angle between the orientation of the axis of a constructive solid geometry primitive and the X-axis of the placement coordinate system
value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Y-axis of the placement coordinate system
value of the angle between the orientation of the axis of a constructive solid geometry primitive and the Z-axis of the placement coordinate system
value as specified by level (miNomax) of the distance on the y-axis of the centre of a sphere
value as specified by level (miNomax) of the distance on the z-axis of the centre of a sphere
value as specified by level (miNomax) of the length of the edge of a N-edged regular column
value as specified by level (miNomax) of the length of the inner radius of a right circular tube
value as specified by level (miNomax) of the length of the outer radius of a right circular tube
code of the type of connection a terminal or connector is being designed for
value indicating the number of corners defining the column type
nominal value of the displacement of the centre of gravity of a component in z-axis direction with respect to the reference point of the component
that part of the type number of a component which identifies its generic function
code as required by a component manufacturer or supplier to identify the component when placing an order
reference to an international, regional, national standard, regulation, directive, or organization based specification etc to which an object shall be made
name or abreviation of the authority or organization being in charge of the referred specification document
reference to an international standard describing a component
reference to a regional or national standard describing a component
MIL code of the specification in which an electric, electronic or electromechanical component is released under the MIL quality assessment system
abbreviated name of the office which has approved the safety of an electric, electronic or electromechanical component
ADA084ADA084power loss of a component with losses proportional to I² during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency
reference to a document depicting the power loss of a component with losses not proportional to I² during the state under load up to the maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency
amount of electric conducting routes of an object carrying the current, contributing to thermal losses in type and routine tests
required minimum current derating factor of an electric-electronic or electromechanical component, for a specified ambient temperature higher than the rated temperature
power consumption when the item is in a non-operating up state during non-required time and measured at rated ambient temperature and rated frequency
power loss of a component with linear losses proportional to I during the state under load at maximum possible continuous rms current (= rated current) and measured at rated ambient temperature and at rated frequency
average ratio of the duration of energization to the total period in which intermittent or continuous or temporary duty takes place
thermal power loss caused by the over- current in a short-circuit or in a situation equivalent to a short-circuit measured at given duration and at rated ambient temperature
Imported properties15#
AAD175functionAAD179simulator model fileAAD180simulator model file dateAAD181simulator nameAAD182simulator versionAAD183simulator complianceAAD184simulator applicabilityAAD185wafer thicknessAAD186wafer thickness toleranceAAD187wafer mapAAD188bump shapeAAD189bump drawingAAD190bump attachment methodAAD196moisture sensitivity levelAAD199outline drawing
Subclasses5#
Is case of (powertype parents)1#
Metadata#
- Synonyms
- semiconductor die
- Version
- 2
- Revision
- 1
- Status
- Standard
- Publisher
- IEC
- Published in
- IEC 61360-4
- Responsible committee
- IEC/SC 3D
- Change request
C00162- Dates
- Original: 2010-11-11
- Current version: 2025-09-26
- Current revision: 2025-09-26
Full source data#
Every key from the original .xls export, including multilingual variants, status, publisher, committee, and workbook-specific codes.
Raw properties (22 keys from source .xls) — click to expand
- C002
- C00162
- C011
- IEC
- C012
- IEC 61360-4
- C016
- Standard
- C021
- 0112/2///61360_4#AAD004
- MDC_P001_5
- 0112/2///61360_4#AAA302
- MDC_P002_1
- 2
- MDC_P002_2
- 1
- MDC_P003_0
- 2025-09-26
- MDC_P003_1
- 2010-11-11
- MDC_P003_2
- 2025-09-26
- MDC_P003_3
- 2025-09-26
- MDC_P004.en
- die device
- MDC_P005.en
- DIE
- MDC_P006.en
- bare semiconductor die or wafer, with or without connection structures, or minimally-packaged dies or wafers
- MDC_P007.en
- semiconductor die
- MDC_P010
- 0112/2///61360_4#AAA301
- MDC_P011
- ITEM_CLASS
- MDC_P012
- IEC/SC 3D
- MDC_P013
- {0112/2///61360_4#AAA057}
- MDC_P014
- {0112/2///61360_4#AAD001,0112/2///61360_4#AAD002,0112/2///61360_4#AAD003,0112/2///61360_4#AAD004,0112/2///61360_4#AAD008,0112/2///61360_4#AAD009,0112/2///61360_4#AAD010,0112/2///61360_4#AAD011,0112/2///61360_4#AAD019,0112/2///61360_4#AAD020,0112/2///61360_4#AAD021,0112/2///61360_4#AAD022,0112/2///61360_4#AAD023,0112/2///61360_4#AAD031,0112/2///61360_4#AAD032,0112/2///61360_4#AAD033,0112/2///61360_4#AAD049,0112/2///61360_4#AAD054,0112/2///61360_4#AAD055,0112/2///61360_4#AAD056,0112/2///61360_4#AAD060,0112/2///61360_4#AAD070,0112/2///61360_4#AAD071,0112/2///61360_4#AAD072,0112/2///61360_4#AAD082,0112/2///61360_4#AAD085,0112/2///61360_4#AAD086,0112/2///61360_4#AAD087,0112/2///61360_4#AAD088,0112/2///61360_4#AAD089,0112/2///61360_4#AAD090,0112/2///61360_4#AAD095,0112/2///61360_4#AAD117,0112/2///61360_4#AAD118,0112/2///61360_4#AAD127,0112/2///61360_4#AAD129,0112/2///61360_4#AAD130,0112/2///61360_4#AAD131,0112/2///61360_4#AAD132,0112/2///61360_4#AAD133,0112/2///61360_4#AAD134,0112/2///61360_4#AAD137,0112/2///61360_4#AAD140,0112/2///61360_4#AAD141,0112/2///61360_4#AAD142,0112/2///61360_4#AAD143,0112/2///61360_4#AAD144,0112/2///61360_4#AAD145,0112/2///61360_4#AAD151,0112/2///61360_4#AAD153,0112/2///61360_4#AAD154,0112/2///61360_4#AAD156,0112/2///61360_4#AAD157,0112/2///61360_4#AAD158,0112/2///61360_4#AAD159,0112/2///61360_4#AAD160,0112/2///61360_4#AAD161,0112/2///61360_4#AAD162,0112/2///61360_4#AAD163,0112/2///61360_4#AAD164,0112/2///61360_4#AAD165,0112/2///61360_4#AAD166,0112/2///61360_4#AAD167,0112/2///61360_4#AAD168,0112/2///61360_4#AAD169,0112/2///61360_4#AAD170,0112/2///61360_4#AAD176,0112/2///61360_4#AAD177,0112/2///61360_4#AAD191,0112/2///61360_4#AAD192,0112/2///61360_4#AAD193,0112/2///61360_4#AAD194,0112/2///61360_4#AAD195,0112/2///61360_4#AAD200,0112/2///61360_4#AAD202,0112/2///61360_4#AAD203,0112/2///61360_4#AAD204,0112/2///61360_4#AAD205,0112/2///61360_4#AAD206,0112/2///61360_4#AAD207,0112/2///61360_4#AAD208,0112/2///61360_4#AAD209,0112/2///61360_4#AAD212,0112/2///61360_4#AAD213,0112/2///61360_4#AAD214,0112/2///61360_4#AAD215,0112/2///61360_4#AAD216,0112/2///61360_4#AAD217,0112/2///61360_4#AAD218,0112/2///61360_4#AAD219,0112/2///61360_4#AAD220,0112/2///61360_4#AAD221,0112/2///61360_4#AAD178,0112/2///61360_4#AAD210,0112/2///61360_4#AAD211,0112/2///61360_4#AAD201}
- MDC_P090
- {0112/2///61360_4#AAD175,0112/2///61360_4#AAD179,0112/2///61360_4#AAD180,0112/2///61360_4#AAD181,0112/2///61360_4#AAD182,0112/2///61360_4#AAD183,0112/2///61360_4#AAD184,0112/2///61360_4#AAD185,0112/2///61360_4#AAD186,0112/2///61360_4#AAD187,0112/2///61360_4#AAD188,0112/2///61360_4#AAD189,0112/2///61360_4#AAD190,0112/2///61360_4#AAD196,0112/2///61360_4#AAD199}
Version history6#
IEC CDD records every published revision of each entity — version number, status, timestamp, and the change request that introduced it. OpenCDD captures the full chain of custody from cdd.iec.ch; the entry marked Current is the one rendered on this page.